[PDF] Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis By Ali Jamnia Free Download


[PDF] Download Ali Jamnia by Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis

Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis written by Ali Jamnia is very useful for Mechanical Engineering (MECH) students and also who are all having an interest to develop their knowledge in the field of Design, Automobile, Production, Thermal Engineering as well as all the works related to Mechanical field. This Book provides an clear examples on each and every topics covered in the contents of the book to provide an every user those who are read to develop their knowledge.

Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis written to meet exhaustively the requirements of various syllabus in the subject of the courses in B.E /B.Tech/ B.Sc (Engineering) of various Indian Universities. It is Equally suitable for UPSC, AIME and all other competitive examinations in the field of Engineering.

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Description of a Book

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification.
This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest.

Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities.

By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

About Author

Ali Jamnia

Book Details

Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis written by Ali Jamnia detailed in the below table…

Name of the Book Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis
Name of the Author(s) Ali Jamnia
Language English

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